Y10T 156/19
Delaminating means
Y10T156/19 (Delaminating means) appears on 2,070 US grants and 1,472 published applications in this corpus.
Search patents in Y10T- Granted patents
- 2,070
- Published applications
- 1,472
- Assignees
- 934
- Inventors
- 3,662
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 24 | 0 |
| 1977 | 11 | 0 |
| 1978 | 13 | 0 |
| 1979 | 8 | 0 |
| 1980 | 19 | 0 |
| 1981 | 30 | 0 |
| 1982 | 31 | 0 |
| 1983 | 18 | 0 |
| 1984 | 16 | 0 |
| 1985 | 25 | 0 |
| 1986 | 19 | 0 |
| 1987 | 31 | 0 |
| 1988 | 22 | 0 |
| 1989 | 51 | 0 |
| 1990 | 39 | 0 |
| 1991 | 24 | 0 |
| 1992 | 33 | 0 |
| 1993 | 23 | 0 |
| 1994 | 29 | 0 |
| 1995 | 33 | 0 |
| 1996 | 39 | 0 |
| 1997 | 31 | 0 |
| 1998 | 46 | 0 |
| 1999 | 44 | 0 |
| 2000 | 64 | 0 |
| 2001 | 47 | 17 |
| 2002 | 53 | 67 |
| 2003 | 53 | 67 |
| 2004 | 61 | 61 |
| 2005 | 43 | 75 |
| 2006 | 35 | 58 |
| 2007 | 34 | 68 |
| 2008 | 37 | 79 |
| 2009 | 33 | 79 |
| 2010 | 63 | 55 |
| 2011 | 64 | 81 |
| 2012 | 73 | 65 |
| 2013 | 67 | 84 |
| 2014 | 79 | 99 |
| 2015 | 68 | 100 |
| 2016 | 80 | 71 |
| 2017 | 80 | 54 |
| 2018 | 74 | 61 |
| 2019 | 78 | 54 |
| 2020 | 46 | 48 |
| 2021 | 42 | 41 |
| 2022 | 49 | 23 |
| 2023 | 30 | 29 |
| 2024 | 30 | 17 |
| 2025 | 15 | 12 |
| 2026 | 13 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- Y10T 156/1978Delaminating bending means523
- Y10T 156/1961Severing delaminating means [e.g., chisel, etc.]418
- Y10T 156/1928Differential fluid pressure delaminating means400
- Y10T 156/1911Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]315
- Y10T 156/195Delaminating roller means268
- Y10T 156/1994Means for delaminating from release surface267
- Y10T 156/1906Delaminating means responsive to feed or shape at delamination205
- Y10T 156/1922Vibrating delaminating means61
Recent patents
- Peeling system and peeling method for flexible fingerprint component14 Jul 2026US 12,679,083 B2Beijing BOE Sensor Technology Co., Ltd.
- Thermal decomposition apparatus and thermal decomposition method applying the same23 Jun 2026US 12,666,749 B2Industrial Technology Research Institute
- Device and method for peeling off protective films from plate-shaped objects26 May 2026US 12,636,873 B2Advanced Engineering Industrie Automation GmbH
- Systems and methods of automatic film removal12 May 2026US 12,623,368 B2General Electric Company
- Composite backing layer peel starter12 May 2026US 12,623,449 B2The Boeing Company
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same20 Aug 2026US 2026/0247905 A1Adeia Semiconductor Bonding Technologies Inc.
- Substrate processing apparatus and substrate processing method13 Aug 2026US 2026/0239913 A1Tokyo Electron Limited
- Substrate bonding device, calculation device, substrate bonding method, and calculation method6 Aug 2026US 2026/0231716 A1SCREEN Holdings Co., Ltd.
- Delamination of used solar module16 Jul 2026US 2026/0200225 A1SOLARCYCLE, Inc.
Most cited
By later US patents
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Controlled cleavage process and device for patterned films344US 6,528,391 B1Silicon Genesis Corporation · 2003
- Controlled cleaving process280US 7,371,660 B2Silicon Genesis Corporation · 2008
- Micro device transfer head heater assembly and method of transferring a micro device220US 8,349,116 B1LuxVue Technology Corporation · 2013
- Method and apparatus for performing a magnetic separation purification procedure on a sample solution198US 6,605,213 B1Gen-Probe Incorporated · 2003