Y10T 156/1911
Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
Y10T156/1911 (Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]) appears on 315 US grants and 285 published applications in this corpus.
Search patents in Y10T- Granted patents
- 315
- Published applications
- 285
- Assignees
- 194
- Inventors
- 717
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 5 | 2 |
| 2003 | 1 | 2 |
| 2004 | 2 | 3 |
| 2005 | 2 | 5 |
| 2006 | 5 | 4 |
| 2007 | 1 | 7 |
| 2008 | 0 | 9 |
| 2009 | 1 | 12 |
| 2010 | 6 | 13 |
| 2011 | 7 | 18 |
| 2012 | 16 | 11 |
| 2013 | 12 | 19 |
| 2014 | 21 | 24 |
| 2015 | 12 | 23 |
| 2016 | 16 | 25 |
| 2017 | 21 | 19 |
| 2018 | 32 | 13 |
| 2019 | 27 | 25 |
| 2020 | 10 | 17 |
| 2021 | 21 | 11 |
| 2022 | 11 | 5 |
| 2023 | 11 | 8 |
| 2024 | 10 | 6 |
| 2025 | 5 | 3 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Thermal decomposition apparatus and thermal decomposition method applying the same23 Jun 2026US 12,666,749 B2Industrial Technology Research Institute
- Automated dismantling and separation system for solar panels27 Jan 2026US 12,533,874 B2
- Automated pharmaceutical bottle information removal apparatus13 Jan 2026US 12,521,774 B1Tangent Design LLC
- Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same7 Oct 2025US 12,438,014 B2Samsung Electronics Co., Ltd.
- Separating system and separating method23 Sep 2025US 12,424,461 B2Tokyo Electron Limited
- Substrate debonding system including light irradiation apparatus8 Jan 2026US 2026/0011581 A1Samsung Electronics Co., Ltd.
- Glass cover disassembly equipment and glass cover disassembly method using the same7 Aug 2025US 2025/0249676 A1Industrial Technology Research Institute
- Automated dismantling and separation system for solar panels5 Jun 2025US 2025/0178333 A1Glotern Green Energy Co., Ltd.
- Plate cooling device and de-bonding station with plate cooling device27 Mar 2025US 2025/0100267 A1Sky Tech Inc.
- Heat stamp and method for releasing protective tape using heat stamp26 Sep 2024US 2024/0321606 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Micro device transfer head heater assembly and method of transferring a micro device220US 8,349,116 B1LuxVue Technology Corporation · 2013
- Methods for separating individual semiconductor devices from a carrier95US 7,989,266 B2Aptina Imaging Corporation · 2011
- Heated pad decorator74US 4,511,425 ADennison Manufacturing Company · 1985
- Apparatus and method for handling fragile semiconductor wafers51US 5,273,615 AMotorola, Inc. · 1993
- Method for forming a layer of blown cellular urethane on a carpet backing49US 4,512,831 A1985