Apparatus and method for handling fragile semiconductor wafers

An apparatus for handling a fragile semiconductor wafer, comprising:

• a rigid submount having a front surface and a back surface opposite the front surface, wherein the semiconductor wafer has a first surface mounted to the front surface of the rigid submount by a high temperature adhesive, the wafer has a second surface which is exposed, and the rigid submount has a plurality of holes formed therein allowing liquid to pass from the back surface to the front surface;
• a vacuum chuck for holding the second surface of the wafer;
• a solvent chamber including a cavity for holding a pool of solvent, an annular portion surrounding the cavity, and an inlet coupled to the cavity for filling the cavity with solvent;
• an annular seal on the annular portion of the solvent chamber, wherein the annular seal is shaped to provide a solvent-tight seal against the back surface of the rigid submount such that the plurality of holes in the rigid submount are over the cavity of the solvent chamber;
• means for clamping the rigid submount against the annular seal;
• means for remounting the wafer onto the rigid submount using a low temperature adhesive wax;
• means for removing the remounted wafer from the vacuum chuck;
• and
• means for attaching the second surface of the remounted wafer onto an adhesive tape.