Heat stamp and method for releasing protective tape using heat stamp

A heat stamp used for releasing a protective tape from a substrate,

• the substrate including
• a first substrate surface,
• a second substrate surface provided opposite to the first substrate surface,
• the protective tape pasted on the second substrate surface, and
• a release tape having a strip-like configuration, the release tape being pasted on the protective tape from above a fifth end of the second substrate surface to above a sixth end of the second substrate surface, the fifth end and the sixth end facing each other across the center of the second substrate surface,
• the heat stamp comprising:
• a bottom surface having a first side, the first side being provided on a side of a releasing direction of the release tape, the releasing direction being parallel to a longitudinal direction of the strip-like configuration, and the releasing direction being from above the fifth end of the second substrate surface to above the sixth end of the second substrate surface,
• wherein, when the bottom surface is pressed on the release tape, the first side has a protrusion protruding in the releasing direction of the release tape, the protrusion is provided between a first end of the first side and a second end of the first side, and the first end and the second end are provided separately from each other in a direction intersecting the releasing direction.