Y10T 156/1917
Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
Y10T156/1917 (Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]) appears on 130 US grants and 144 published applications in this corpus.
Search patents in Y10T- Granted patents
- 130
- Published applications
- 144
- Assignees
- 90
- Inventors
- 300
- Latest grant
- 7 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 7 |
| 2010 | 1 | 8 |
| 2011 | 4 | 13 |
| 2012 | 8 | 8 |
| 2013 | 7 | 7 |
| 2014 | 11 | 9 |
| 2015 | 6 | 14 |
| 2016 | 9 | 17 |
| 2017 | 12 | 13 |
| 2018 | 18 | 6 |
| 2019 | 15 | 15 |
| 2020 | 5 | 9 |
| 2021 | 11 | 5 |
| 2022 | 8 | 4 |
| 2023 | 7 | 5 |
| 2024 | 5 | 2 |
| 2025 | 3 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same7 Oct 2025US 12,438,014 B2Samsung Electronics Co., Ltd.
- Separating system and separating method23 Sep 2025US 12,424,461 B2Tokyo Electron Limited
- Peeling method25 Mar 2025US 12,258,499 B2Nitto Denko Corporation
- Micro-LED manufacturing device26 Nov 2024US 12,154,816 B2Hardram Co., Ltd.
- Manufacturing apparatus of semiconductor device29 Oct 2024US 12,131,921 B2Kabushiki Kaisha Shinkawa
- Substrate debonding system including light irradiation apparatus8 Jan 2026US 2026/0011581 A1Samsung Electronics Co., Ltd.
- Method, holder and adapter for treating microchip substrates9 May 2024US 2024/0150923 A1MTI, Inc.
- Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same14 Mar 2024US 2024/0087921 A1Samsung Electronics Co., Ltd.
- Peeling method7 Dec 2023US 2023/0392044 A1Nitto Denko Corporation
- Manufacturing apparatus of semiconductor device2 Nov 2023US 2023/0352324 A1Kabushiki Kaisha Shinkawa
Most cited
By later US patents
- Separating method of bonded body39US 8,211,259 B2Seiko Epson Corporation · 2012
- Laser-based methods of stripping fiber optic cables31US 8,052,836 B2Corning Cable Systems LLC · 2011
- Apparatus for temporary wafer bonding and debonding19US 8,181,688 B2Suss Microtec Lithography GmbH · 2012
- Laser lift off systems and methods17US 8,986,497 B2Ipg Photonics Corporation · 2015
- Apparatus for mechanically debonding temporary bonded semiconductor wafers16US 8,267,143 B2Suss Microtec Lithography GmbH · 2012