Micro-LED manufacturing device
AssigneeHardram Co., Ltd.
InventorsSung Wook Min, Yeo Chan Yoon
Life of this patent
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Abstract
A micro-LED manufacturing device includes: a wafer stage on which a wafer is positioned; a substrate stage on which a substrate is positioned; a lower base formed below the substrate stage; a first driving member formed on the substrate stage so as to move the wafer stage; and a second driving member formed on the lower base SO as to move the substrate stage. The micro-LED manufacturing device is formed such that the wafer stage moves over the substrate stage, and thus the substrate stage and the wafer stage can move synchronously with respect to the lower base.
Claims7
A micro-LED manufacturing device for transferring micro-LED chips of a wafer on a substrate by radiating laser light, the device comprising:
- a wafer stage on the bottom of which the wafer is positioned;
- a substrate stage on which the substrate is positioned;
- a lower base formed under the substrate stage;
- a first driving member formed on the substrate stage to move the wafer stage;
- and
- a second driving member formed on the lower base to move the substrate stage, wherein
- a structure for moving the wafer stage is formed on the substrate stage so that the substrate stage and the wafer stage may move simultaneously in an integrated manner with respect to the lower base.
Dependencies are inferred from the claim text.