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US 12,438,014 B2Granted
Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same
AssigneeSamsung Electronics Co., Ltd.
InventorJaehyuk Choi
Life of this patent
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Abstract
A light irradiation apparatus including a stage configured to support a substrate; and a light emitting diode (LED) module spaced apart from the stage, wherein the LED module includes a plurality of LEDs, wherein some of the plurality of LEDs are arranged in a first direction, and wherein others of the plurality of LEDs are provided in a second direction, the second direction intersecting the first direction.
Claims9
A substrate debonding method, comprising:
- irradiating light to a substrate assembly;
- and
- after irradiating the light, separating a glass substrate of the substrate assembly from a substrate of the substrate assembly,
- wherein irradiating the light to the substrate assembly comprises:
- placing the substrate assembly, including the glass substrate and the substrate, on a stage of a light irradiation apparatus;
- and
- irradiating, by a light emitting diode (LED) module of the light irradiation apparatus and through the glass substrate in a first direction towards the stage, ultraviolet (UV) radiation to an adhesion layer of the substrate assembly, the adhesion layer being between the glass substrate and the substrate,
- wherein the LED module comprises a plurality of LEDs,
- wherein some of the plurality of LEDs are arranged in a second direction, the second direction intersecting the first direction,
- wherein others of the plurality of LEDs are arranged in a third direction, the third direction intersecting the second direction, and
- wherein outermost LEDs among the plurality of LEDs are arranged in a circular shape.
8 more elements
Dependencies are inferred from the claim text.