Apparatus for temporary wafer bonding and debonding
AssigneeSuss Microtec Lithography GmbH
InventorsHale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles, Michael Kuhnle
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Abstract
An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.
Claims16
An improved apparatus for temporary bonding and debonding of electronic wafer structures comprising:
- a cluster of temporary bonder modules comprising:
- first bonder module comprising equipment for forming a temporary bond between two wafer surfaces via an adhesive layer;
- second bonder module comprising equipment for forming a temporary bond between two wafer surfaces via a combination of an adhesive layer with a release layer;
- and
- a cluster of debonder modules comprising:
- a thermal-slide debonder module comprising equipment for debonding two via an adhesive layer temporary bonded wafers, wherein said equipment comprises means for heating the two bonded wafers and means for sliding one wafer relative to the other while heat is applied;
- a mechanical debonder module comprising equipment for debonding two via a combination of an adhesive layer with a release layer temporary bonded wafers, wherein said equipment comprises means for heating the two bonded wafers and means for mechanically pushing one wafer perpendicularly away from the other while heat is applied.
Dependencies are inferred from the claim text.