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US 2025/0100267 A1Published application
Plate cooling device and de-bonding station with plate cooling device
AssigneeSky Tech Inc.
InventorsJUNG-HUA CHANG, Ta-Hao Kuo
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Abstract
A plate cooling device for cooling carrier plate of a wafer, includes a cooling plate and a plurality of contact pads. The cooling plate includes an upper surface; wherein the upper surface is provided with a cooling area for placing the wafer thereon. The contact pads are disposed on the upper surface. The contact pads protrude on the upper surface, and the total area of the contact pads is less than 3% of the area of the carrier plate.
Claims10
A plate cooling device for cooling carrier plate of a wafer comprising:
- a cooling plate including an upper surface;
- and
- a plurality of contact pad disposed on the upper surface;
- wherein the contact pads protrude on the upper surface, and the total area of the contact pads is less than 3% of the area of the carrier plate.
1 more element
Dependencies are inferred from the claim text.