Y10T 156/1978
Delaminating bending means
Y10T156/1978 (Delaminating bending means) appears on 523 US grants and 436 published applications in this corpus.
Search patents in Y10T- Granted patents
- 523
- Published applications
- 436
- Assignees
- 284
- Inventors
- 1,042
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 10 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 11 | 0 |
| 1996 | 10 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 10 | 0 |
| 2001 | 15 | 6 |
| 2002 | 8 | 15 |
| 2003 | 12 | 12 |
| 2004 | 12 | 19 |
| 2005 | 7 | 19 |
| 2006 | 8 | 20 |
| 2007 | 14 | 26 |
| 2008 | 14 | 22 |
| 2009 | 6 | 21 |
| 2010 | 34 | 18 |
| 2011 | 18 | 25 |
| 2012 | 21 | 19 |
| 2013 | 17 | 23 |
| 2014 | 27 | 30 |
| 2015 | 26 | 34 |
| 2016 | 33 | 22 |
| 2017 | 31 | 17 |
| 2018 | 26 | 19 |
| 2019 | 23 | 16 |
| 2020 | 12 | 12 |
| 2021 | 10 | 13 |
| 2022 | 16 | 5 |
| 2023 | 10 | 8 |
| 2024 | 5 | 5 |
| 2025 | 1 | 6 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Peeling system and peeling method for flexible fingerprint component14 Jul 2026US 12,679,083 B2Beijing BOE Sensor Technology Co., Ltd.
- Systems and methods of automatic film removal12 May 2026US 12,623,368 B2General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same5 May 2026US 12,622,207 B2Adeia Semiconductor Bonding Technologies Inc.
- Substrate bonding device, calculation device, substrate bonding method, and calculation method7 Apr 2026US 12,598,939 B2SCREEN Holdings Co., Ltd.
- Prepreg composite material ply and backing separation systems and methods31 Mar 2026US 12,589,585 B2Accudyne Systems, Inc.
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same20 Aug 2026US 2026/0247905 A1Adeia Semiconductor Bonding Technologies Inc.
- Substrate bonding device, calculation device, substrate bonding method, and calculation method6 Aug 2026US 2026/0231716 A1SCREEN Holdings Co., Ltd.
- Method of preparing a bonding surface on a composite laminate and associated composite laminate19 Mar 2026US 2026/0077564 A1The Boeing Company
- Apparatus for applying rubberized electronic tags to a tyre being processed4 Sep 2025US 2025/0276502 A1Pirelli Tyre S. P. A.
Most cited
By later US patents
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003
- Protective material applicator device91US 8,393,377 B2Superior Communications, Inc. · 2013
- Process for disengaging semiconductor die from an adhesive film89US 6,889,427 B2Freescale Semiconductor, Inc. · 2005
- Transfer adhesive dispensing device80US 3,969,181 AMinnesota Mining and Manufacturing Company · 1976
- Fixture for securing an adhesive attachment to a substrate78US 4,822,656 APhysical Systems, Inc. · 1989