Y10T 156/1983
Poking delaminating means
Y10T156/1983 (Poking delaminating means) appears on 198 US grants and 154 published applications in this corpus.
Search patents in Y10T- Granted patents
- 198
- Published applications
- 154
- Assignees
- 134
- Inventors
- 436
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 5 | 0 |
| 2001 | 8 | 2 |
| 2002 | 2 | 6 |
| 2003 | 3 | 7 |
| 2004 | 5 | 11 |
| 2005 | 6 | 12 |
| 2006 | 2 | 9 |
| 2007 | 11 | 8 |
| 2008 | 7 | 7 |
| 2009 | 4 | 12 |
| 2010 | 13 | 6 |
| 2011 | 4 | 8 |
| 2012 | 7 | 7 |
| 2013 | 7 | 8 |
| 2014 | 8 | 11 |
| 2015 | 7 | 8 |
| 2016 | 14 | 5 |
| 2017 | 6 | 4 |
| 2018 | 6 | 2 |
| 2019 | 5 | 5 |
| 2020 | 2 | 5 |
| 2021 | 3 | 3 |
| 2022 | 2 | 1 |
| 2023 | 4 | 2 |
| 2024 | 2 | 2 |
| 2025 | 0 | 1 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same5 May 2026US 12,622,207 B2Adeia Semiconductor Bonding Technologies Inc.
- Substrate bonding device, calculation device, substrate bonding method, and calculation method7 Apr 2026US 12,598,939 B2SCREEN Holdings Co., Ltd.
- Semiconductor manufacturing apparatus and method of manufacturing semiconductor device13 Feb 2024US 11,901,201 B2Mitsubishi Electric Corporation
- Bonding apparatus and bonding method6 Feb 2024US 11,894,246 B2Tokyo Electron Limited
- Mobile dismantling system for dismantling solar cell module19 Dec 2023US 11,845,239 B1Tsgc Technologies Inc.
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same20 Aug 2026US 2026/0247905 A1Adeia Semiconductor Bonding Technologies Inc.
- Substrate bonding device, calculation device, substrate bonding method, and calculation method6 Aug 2026US 2026/0231716 A1SCREEN Holdings Co., Ltd.
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same2 Jan 2025US 2025/0006520 A1Adeia Semiconductor Bonding Technologies Inc.
- Processing apparatus separating multilayer material, processing method, and method for manufacturing article using processing apparatus19 Sep 2024US 2024/0308129 A1Canon Kabushiki Kaisha
- Mobile dismantling system for dismantling solar cell module11 Jan 2024US 2024/0009972 A1Taiwan Solar Greenergy Corporation
Most cited
By later US patents
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003
- Process for disengaging semiconductor die from an adhesive film89US 6,889,427 B2Freescale Semiconductor, Inc. · 2005
- Method of and device for feeding electric and/or electronic elements to given positions75US 4,494,902 AU. S. Philips Corporation · 1985
- Semiconductor chip-supply method and apparatus66US 5,589,029 AMatsushita Electric Industrial Co., Ltd. · 1996
- Method and device of peeling semiconductor device using annular contact members63US 6,824,643 B2Fujitsu Limited · 2004