Semiconductor chip-supply method and apparatus

A semiconductor chip-supply apparatus, comprising:

• a sucking member disposed below an adhesive sheet and having a suction face for sucking a lower face of the adhesive sheet thereto and holding the adhesive sheet thereon, a semiconductor chip being bonded to an upper face of the adhesive sheet with the adhesive sheet being positioned below the semiconductor chip;
• a push-up needle that has a tip thereof positioned adjacent to the lower face of the adhesive sheet;
• a driving means for moving said sucking member and the adhesive sheet that is sucked to and held by said sucking member downward relative to said push-up needle so as to cause relative upward movement of said push-up needle with respect to said sucking member and the adhesive sheet such that said push-up needle can carry out a push-up operation while said sucking member sucks the adhesive sheet thereto;
• and
• a sucking collet for sucking and transporting the semiconductor chip separated from the adhesive sheet by the pushup operation of said push-up needle.