Peeling system and peeling method for flexible fingerprint component

A peeling method for a flexible fingerprint component, comprising:

• providing a flexible fingerprint component formed on a rigid substrate, wherein the flexible fingerprint component is formed on the rigid substrate, the flexible fingerprint component comprises a flexible substrate, a photosensitive device layer and an optical film sequentially on the flexible substrate, a first chip-on film, on a first side of the optical film, bonded to the photosensitive device layer, and a second chip-on film, on a second side of the optical film, bonded to the photosensitive device layer, the optical film is provided with an extension portion beyond the flexible substrate, the second side of the optical film is on a side opposite to the extension portion, and the first side of the optical film is on a side adjacent to the extension portion;
• adsorbing and fixing the rigid substrate by using a first vacuum adsorption platform;
• clamping the extension portion by using a clamp;
• and
• adjusting, by using a control mechanism, an angle of a pulling force applied by the clamp to the extension portion to a peeling angle that is preset, and controlling the clamp to lift the extension portion at the peeling angle, so as to drive the flexible substrate to be peeled off from the rigid substrate according to a preset peeling speed;
• wherein the clamping the extension portion by using the clamp, and the adjusting, by using the control mechanism, the angle of the pulling force applied by the clamp to the extension portion to the peeling angle that is preset, and controlling the clamp to lift the extension portion at the peeling angle specifically comprise:
• clamping the extension portion by a first clamping plate and a second clamping plate, and after adjusting, by a first manipulator and a second manipulator, the first clamping plate and the second clamping plate to rotate to the peeling angle respectively through a first rotating shaft and a second rotating shaft, maintaining the peeling angle by the first manipulator and the second manipulator, and continuing to control the first clamping plate and the second clamping plate to lift the extension portion at the peeling angle in a pulling force mode.