Y10S 438/959
Mechanical polishing of wafer
Y10S438/959 (Mechanical polishing of wafer) appears on 242 US grants and 97 published applications in this corpus.
Search patents in Y10S- Granted patents
- 242
- Published applications
- 97
- Assignees
- 103
- Inventors
- 428
- Latest grant
- 23 May 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 9 | 0 |
| 1995 | 10 | 0 |
| 1996 | 12 | 0 |
| 1997 | 3 | 0 |
| 1998 | 6 | 0 |
| 1999 | 20 | 0 |
| 2000 | 19 | 0 |
| 2001 | 22 | 12 |
| 2002 | 21 | 12 |
| 2003 | 13 | 11 |
| 2004 | 16 | 17 |
| 2005 | 17 | 8 |
| 2006 | 9 | 8 |
| 2007 | 5 | 8 |
| 2008 | 4 | 2 |
| 2009 | 5 | 6 |
| 2010 | 8 | 3 |
| 2011 | 4 | 2 |
| 2012 | 5 | 6 |
| 2013 | 1 | 1 |
| 2014 | 1 | 0 |
| 2015 | 4 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Semiconductor device having a high-K gate dielectric above an STI region23 May 2017US 9,659,928 B2Advanced Micro Devices, Inc.
- Method for self-aligned removal of a high-K gate dielectric above an STI region5 May 2015US 9,023,712 B2Advanced Micro Devices, Inc.
- Creating extremely thin semiconductor-on-insulator (ETSOI) having substantially uniform thickness28 Apr 2015US 9,018,024 B2International Business Machines Corporation
- Radiation detectors and methods of fabricating radiation detectors14 Apr 2015US 9,006,010 B2General Electric Company
- Method for producing silicon epitaxial wafer7 Apr 2015US 8,999,061 B2Sumco Corporation
- Semiconductor device having high-k gate dielectric above an sti region2 Jul 2015US 2015/0187765 A1Advanced Micro Devices, Inc.
- Radiation detectors and methods of fabricating radiation detectors23 May 2013US 2013/0126998 A1General Electric Company
- Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device19 Jul 2012US 2012/0184108 A1Sumitomo Electric Industries, Ltd.
- Method of post-mold grinding a semiconductor package12 Jul 2012US 2012/0175786 A1
- Method for producing silicon epitaxial wafer19 Apr 2012US 2012/0090536 A1Sumco Corporation
Most cited
By later US patents
- Semiconductor wafer edge marking561US 6,710,364 B2Texas Instruments Incorporated · 2004
- Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection345US 5,240,552 AMicron Technology, Inc. · 1993
- Method and apparatus for improving planarity of chemical-mechanical planarization operations307US 5,232,875 AMicron Technology, Inc. · 1993
- Apparatus for endpoint detection during mechanical planarization of semiconductor wafers252US 5,069,002 AMicron Technology, Inc. · 1991
- Method of forming conductive bumps on die for flip chip applications249US 5,736,456 AMicron Technology, Inc. · 1998