Y10S 438/951
Lift-off
Y10S438/951 (Lift-off) appears on 224 US grants and 71 published applications in this corpus.
Search patents in Y10S- Granted patents
- 224
- Published applications
- 71
- Assignees
- 99
- Inventors
- 407
- Latest grant
- 20 May 2014
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 7 | 0 |
| 1983 | 7 | 0 |
| 1984 | 8 | 0 |
| 1985 | 13 | 0 |
| 1986 | 11 | 0 |
| 1987 | 12 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 11 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 7 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 1 |
| 2002 | 2 | 2 |
| 2003 | 3 | 7 |
| 2004 | 8 | 9 |
| 2005 | 3 | 6 |
| 2006 | 10 | 9 |
| 2007 | 3 | 11 |
| 2008 | 5 | 6 |
| 2009 | 9 | 4 |
| 2010 | 9 | 5 |
| 2011 | 6 | 10 |
| 2012 | 9 | 1 |
| 2013 | 1 | 0 |
| 2014 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Self-aligned multi-dielectric-layer lift off process for laser diode stripes20 May 2014US 8,728,842 B2Soraa Laser Diode, Inc.
- Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof12 Feb 2013US 8,373,339 B2LG Display Co., Ltd.
- Method for fabricating LED chip comprising reduced mask count and lift-off processing15 May 2012US 8,178,376 B2Lextar Electronics Corporation
- Method for fabricating lED chip comprising reduced mask count15 May 2012US 8,178,377 B2Lextar Electronics Corporation
- Method for fabricating LED chip comprising reduced mask count and lift-off processing8 May 2012US 8,173,465 B2Lextar Electronics Corporation
- Self-Aligned Multi-Dielectric-Layer Lift Off Process for Laser Diode Stripes12 Jul 2012US 2012/0178198 A1Soraa, Inc.
- Stripper Solution and Method of Manufacturing Liquid Crystal Display Using the Same3 Nov 2011US 2011/0266494 A1
- Method for Fabricating LED Chip Comprising Reduced Mask Count and Lift-Off Processing7 Jul 2011US 2011/0165705 A1Lextar Electronics Corporation
- Method for Fabricating LED Chip Comprising Reduced Mask Count and Lift-Off Processing7 Jul 2011US 2011/0165706 A1Lextar Electronics Corporation
- Method for Fabricating LED Chip Comprising Reduced Mask Count and Lift-Off Processing30 Jun 2011US 2011/0159612 A1Lextar Electronics Corporation
Most cited
By later US patents
- Self-aligned multi-dielectric-layer lift off process for laser diode stripes231US 8,143,148 B1Soraa, Inc. · 2012
- Method of preventing asymmetric etching of lines in sub-micrometer range sidewall images transfer230US 4,648,937 AInternational Business Machines Corporation · 1987
- Composite back-etch/lift-off stencil for proximity effect minimization133US 4,560,435 AInternational Business Machines Corporation · 1985
- Method for fabricating tantalum semiconductor contacts113US 4,215,156 AInternational Business Machines Corporation · 1980
- Processing techniques for achieving production-worthy, low dielectric, low dielectric, low interconnect resistance and high performance IC113US 5,679,608 AAdvanced Micro Devices, Inc. · 1997