Y10S 205/92
Electrolytic coating of circuit board or printed circuit, other than selected area
Official title: Electrolytic coating of circuit board or printed circuit, other than selected area coating
Y10S205/92 (Electrolytic coating of circuit board or printed circuit, other than selected area) appears on 60 US grants and 10 published applications in this corpus.
Search patents in Y10S- Granted patents
- 60
- Published applications
- 10
- Assignees
- 36
- Inventors
- 111
- Latest grant
- 12 Sep 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 2 |
| 2003 | 3 | 3 |
| 2004 | 1 | 0 |
| 2005 | 1 | 0 |
| 2006 | 2 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 2 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Production method and device of surface roughened copper plate, and surface roughened copper plate12 Sep 2017US 9,758,890 B2Furukawa Electric Co., Ltd.
- Method for producing a surface roughened copper plate26 Aug 2014US 8,815,072 B2Furukawa Electric Co., Ltd.
- Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating24 Jul 2012US 8,226,804 B2Faraday Technology Corp.
- Method for manufacturing printed circuit board27 Sep 2011US 8,024,856 B2Samsung Electro-Mechanics Co., Ltd.
- Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes24 May 2011US 7,947,161 B2Faraday Technology Corp.
- Production method and device of surface roughened copper plate, and surface roughened copper plate20 Nov 2014US 2014/0339094 A1Furukawa Electric Co., Ltd.
- Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating1 Sep 2011US 2011/0209991 A1Faraday Technology Corp.
- Production method and device of surface roughened copper plate, and surface roughened copper plate2 Dec 2010US 2010/0304176 A1Furukawa Electric Co., Ltd.
- Method for manufacturing printed circuit board2 Apr 2009US 2009/0083976 A1Samsung Electro-Mechanics Co., Ltd.
- Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating14 Feb 2008US 2008/0035475 A1Faraday Technology Corp.
Most cited
By later US patents
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Method and apparatus for controlling plating over a face of a substrate85US 6,090,261 AFormFactor, Inc. · 2000
- Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly69US 6,350,386 B12002
- Circuit board material and electroplating bath for the production thereof64US 4,892,776 AOhmega Electronics, Inc. · 1990
- Circuit board material and method of making63US 4,888,574 A501 Ohmega Electronics, Inc. · 1989