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US 2011/0209991 A1Published application
Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating
AssigneesThe United States of America as represented by the Secretary of the Air Force, Faraday Technology Corp.
InventorsLawrence E. Gebhart, E. Jennings Taylor
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Abstract
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.
Claims14
A plating cell comprising:
- a workpiece holder,
- an anode,
- a plurality of eductors for directing an electrolyte solution into the plating cell, and
- a solution flow dampening member,
- wherein the eductors, the dampening member and the workpiece are arranged such that electrolyte solution ejected from the eductors is directed by the dampening member to flow across the surface of the workpiece.
2 more elements
A plating cell comprising:
- a holder for a workpiece having first and second major surfaces,
- an anode,
- a plurality of eductors for directing an electrolyte solution into the plating cell,
- a solution flow dampening member, and
- a controller for controlling the flow velocity of the solution over the major surfaces of the workpiece.
- wherein the eductors, the dampening member and the workpiece are arranged such that electrolyte solution ejected from the eductors is directed by the dampening member to flow across the surface of the workpiece;
- and the solution flow velocity over one major surface of the workpiece is greater than the solution flow velocity over the other major surface of the workpiece.
4 more elements
Dependencies are inferred from the claim text.