Y10S 205/00
Electrolysis: processes, compositions used therein, and methods of preparing the compositions
Y10S205/00 (Electrolysis: processes, compositions used therein, and methods of preparing the compositions) appears on 401 US grants and 30 published applications in this corpus.
Search patents in Y10S- Granted patents
- 401
- Published applications
- 30
- Assignees
- 209
- Inventors
- 763
- Latest grant
- 12 Sep 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 19 | 0 |
| 1977 | 14 | 0 |
| 1978 | 19 | 0 |
| 1979 | 10 | 0 |
| 1980 | 7 | 0 |
| 1981 | 8 | 0 |
| 1982 | 13 | 0 |
| 1983 | 18 | 0 |
| 1984 | 22 | 0 |
| 1985 | 20 | 0 |
| 1986 | 28 | 0 |
| 1987 | 14 | 0 |
| 1988 | 9 | 0 |
| 1989 | 24 | 0 |
| 1990 | 14 | 0 |
| 1991 | 7 | 0 |
| 1992 | 17 | 0 |
| 1993 | 8 | 0 |
| 1994 | 13 | 0 |
| 1995 | 14 | 0 |
| 1996 | 10 | 0 |
| 1997 | 8 | 0 |
| 1998 | 9 | 0 |
| 1999 | 9 | 0 |
| 2000 | 18 | 0 |
| 2001 | 8 | 3 |
| 2002 | 9 | 7 |
| 2003 | 10 | 5 |
| 2004 | 6 | 4 |
| 2005 | 3 | 0 |
| 2006 | 2 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 2 |
| 2009 | 1 | 2 |
| 2010 | 0 | 1 |
| 2011 | 2 | 1 |
| 2012 | 2 | 0 |
| 2013 | 1 | 1 |
| 2014 | 1 | 1 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 2 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
- Y10S 205/917Treatment of workpiece between coating steps146
- Y10S 205/92Electrolytic coating of circuit board or printed circuit, other than selected area60
- Y10S 205/924Electrolytic coating substrate predominantly comprised of specified synthetic resin58
- Y10S 205/921Electrolytic coating of printing member, other than selected area coating40
- Y10S 205/923Solar collector or absorber37
- Y10S 205/915Electrolytic deposition of semiconductor29
- Y10S 205/918Use of wave energy or electrical discharge during pretreatment of substrate or24
- Y10S 205/922Electrolytic coating of magnetic storage medium, other than selected area coating24
Recent patents
- Production method and device of surface roughened copper plate, and surface roughened copper plate12 Sep 2017US 9,758,890 B2Furukawa Electric Co., Ltd.
- Silver plating in electronics manufacture8 Aug 2017US 9,730,321 B2
- Silver plating in electronics manufacture24 Mar 2015US 8,986,434 B2Enthone Inc.
- Method for producing a surface roughened copper plate26 Aug 2014US 8,815,072 B2Furukawa Electric Co., Ltd.
- Silver plating in electronics manufacture8 Jan 2013US 8,349,393 B2Enthone Inc.
- Method for nanomodulating metal films by means of high-vacuum cathode sputtering of metals and stencils6 Aug 2020US 2020/0248300 A1Universidad de Santiago de Chile
- Silver plating in electronics manufacture10 Sep 2015US 2015/0257264 A1Enthone Inc.
- Production method and device of surface roughened copper plate, and surface roughened copper plate20 Nov 2014US 2014/0339094 A1Furukawa Electric Co., Ltd.
- Silver plating in electronics manufacture18 Jul 2013US 2013/0180768 A1Enthone Inc.
- Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating1 Sep 2011US 2011/0209991 A1Faraday Technology Corp.
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer203US 6,074,544 ANovellus Systems, Inc. · 2000
- Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer152US 6,162,344 ANovellus Systems, Inc. · 2000
- FRP pipe with threaded ends140US 4,893,658 ANitto Electric Industrial Co., Ltd. · 1990