Y10S 205/916
Sequential electrolytic and nonelectrolytic, or nonelectrolytic and electrolytic coating from the same
Official title: Sequential electrolytic and nonelectrolytic, or nonelectrolytic and electrolytic coating from the same bath
Y10S205/916 (Sequential electrolytic and nonelectrolytic, or nonelectrolytic and electrolytic coating from the same) appears on 12 US grants and 4 published applications in this corpus.
Search patents in Y10S- Granted patents
- 12
- Published applications
- 4
- Assignees
- 10
- Inventors
- 27
- Latest grant
- 8 Aug 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Silver plating in electronics manufacture8 Aug 2017US 9,730,321 B2
- Silver plating in electronics manufacture24 Mar 2015US 8,986,434 B2Enthone Inc.
- Silver plating in electronics manufacture8 Jan 2013US 8,349,393 B2Enthone Inc.
- Seed layer deposition30 Nov 2004US 6,824,665 B2Shipley Company, L.L.C.
- Electrolytic copper plating using a reducing agent3 Oct 1995US 5,454,930 ALeaRonal Japan Inc.
- Silver plating in electronics manufacture10 Sep 2015US 2015/0257264 A1Enthone Inc.
- Silver plating in electronics manufacture18 Jul 2013US 2013/0180768 A1Enthone Inc.
- Silver plating in electronics manufacture2 Feb 2006US 2006/0024430 A1Enthone Inc.
- Seed layer deposition6 Jun 2002US 2002/0066671 A1Shipley Company, L.L.C.
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electrolytic copper plating using a reducing agent17US 5,454,930 ALeaRonal Japan Inc. · 1995
- Method of partially metallizing electrically conductive non-metallic patterns12US 4,478,690 AU. S. Philips Corporation · 1984
- Cathode electrocatalyst10US 4,086,149 APPG Industries, Inc. · 1978
- Silver-electroplating process6US 4,177,114 AHitachi, Ltd. · 1979