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US 5,454,930 AGranted
Electrolytic copper plating using a reducing agent
AssigneeLeaRonal Japan Inc.
InventorsTakeshi Miura, Masaru Seita
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AssigneeLeaRonal Japan Inc.
InventorsTakeshi Miura, Masaru Seita
Estimating the term…
An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition and a copper-complexing agent and has a pH value of about 6 to 7.5, for electrolysis at a temperature of about 15.degree. C. to 50.degree. C., thereby forming an electrically conductive film of copper on said electrically nonconductive substrate. This method can be used in place of conventional electroless copper plating, dispense with any harmful substance such as formaldehyde, be easily analyzed and controlled, form an electrically conductive film of copper on an electrically nonconductive substrate with improved adhesion thereto, and is effectively applicable to making printed circuit boards in particular.
An electrolytic copper plating method using a reducing agent, comprising dipping a catalyzed, electrically nonconductive substrate in a solution which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition, said copper-reducing agent being selected from the group consisting of dimethylamineborane, a hydrazine and its salts, hypophosphorous acid and its salts, and is present in said solution at a concentration at 0.5 to 20 g/l, and a copper-complexing agent and which has a pH value of about 6 to 7.5, and subjecting said catalyzed, electrically nonconductive substrate to electrolysis in said solution at a temperature of about 20.degree. C. to 30.degree. C., thereby forming an electrically conductive film of copper on said nonconductive substrate.
Dependencies are inferred from the claim text.