Y10S 205/917
Treatment of workpiece between coating steps
Y10S205/917 (Treatment of workpiece between coating steps) appears on 146 US grants and 7 published applications in this corpus.
Search patents in Y10S- Granted patents
- 146
- Published applications
- 7
- Assignees
- 100
- Inventors
- 307
- Latest grant
- 6 Dec 2005
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 8 | 0 |
| 1978 | 8 | 0 |
| 1979 | 5 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 5 | 0 |
| 1984 | 11 | 0 |
| 1985 | 9 | 0 |
| 1986 | 9 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 9 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 8 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 2 | 0 |
| 2003 | 2 | 2 |
| 2004 | 3 | 3 |
| 2005 | 2 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for the selectively electroplating a strip-shaped, metal support material6 Dec 2005US 6,972,082 B2IMO Ingo Müller e.K.
- Method of coloring magnesium material, and housing made of colored magnesium material30 Aug 2005US 6,936,349 B2Fujitsu Limited
- Method of fabricating damascene structures in mechanically weak interlayer dielectrics14 Sep 2004US 6,790,336 B2Intel Corporation
- Integrated plating and planarization process and apparatus therefor10 Aug 2004US 6,773,570 B2International Business Machines Corporation
- Method of plating for filling via holes29 Jun 2004US 6,755,957 B2Shinko Electric Industries Co., Ltd.
- Method for nanomodulating metal films by means of high-vacuum cathode sputtering of metals and stencils6 Aug 2020US 2020/0248300 A1Universidad de Santiago de Chile
- Method for the selectively electroplating a strip-shaped, metal support material21 Oct 2004US 2004/0206629 A1IMO Ingo Müller e.K.
- Integrated plating and planarization process and apparatus therefor20 May 2004US 2004/0094427 A1International Business Machines Corporation
- Method and apparatus for plating substrate with copper18 Mar 2004US 2004/0050711 A1
- Method of fabricating damascene structures in mechanically weak interlayer dielectrics25 Dec 2003US 2003/0234182 A1Intel Corporation
Most cited
By later US patents
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Bonding process for grinding tools103US 4,155,721 A1979
- High utilization supported catalytic metal-containing gas-diffusion electrode, process for making it, and cells utilizing it95US 5,084,144 APhysical Sciences, Inc. · 1992
- Method for forming capped copper electrical interconnects65US 5,549,808 AInternational Business Machines Corporation · 1996
- Anodized tantalum pellet for an electrolytic capacitor55US 6,231,993 B1Wilson Greatbatch Ltd. · 2001