Method for the selectively electroplating a strip-shaped, metal support material
AssigneeIMO Ingo Müller e.K.
InventorMichail Kotsias
Life of this patent
Estimating the term…
Abstract
A method for the continuous selective electroplating of a metallic substrate material (10) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrate material (10) is coated in an electrophoretic coating means (14) with an electrophoretic coating composition selective with at least one composition strip, b) the at least one composition strip is removed at those parts by means of a laser (40), which are to be electroplated, c) in an electroplating process a metal layer is applied to the areas (42) deprived of composition in at least one composition strip using selective electroplating and d) the at least one composition strip is then removed.
Claims10
A method for the selective continuous electroplating of a metallic substrate material band and more particularly of a substrate material band having prestamped contact elements, in which
- a) the substrate material (10, 23, 27, 30 and 34) is coated in an electrophoretic coating means (14 and 15) with an electrophoretic coating composition selective with at least one composition strip (22, 24 through 26, 28, 29, 33 and 37),
- b) the at least one composition strip (22, 24 through 26, 28, 39, 33 and 37) is removed at those parts (42) by means of a laser (40), which are to be electroplated,
- c) in an electroplating process a metal layer is applied to the area (42) deprived of composition in at least one composition strip (22, 24 through 26, 28, 29, 33 and 37) using selective electroplating and
- d) the at least one composition strip (22, 24 through 26, 28, 29, 33 and 37) is then removed.
Dependencies are inferred from the claim text.