Method for nanomodulating metal films by means of high-vacuum cathode sputtering of metals and stencils

Method for nanomodulation of metal surfaces, comprising the following steps:

• a) to obtain a template recorded with aluminum nanovalleys, anodizing a high-purity aluminum film consisting of a natural oxide layer very thin of aluminum on its surface, growing said layer by using an electrochemical solution to partially dissolve the oxide aluminum and form a porous layer is supported on the aluminum, which is removed by selective chemical attack with an acidic solution, to thereby obtaining aluminum with semicircular holes arranged hexagonally, and then obtaining an aluminum substrate metal which is recorded with semicircular nanovalleys hexagonally ordered;
• wherein said electrolytic solution is selected from sulfuric acid (H2SO4), oxalic acid (H2C2O4) or phosphoric acid (H3PO4), and said acid solution is a mixture of chromic acid (CrOs), phosphoric acid (H3PO49 and H20;
• b) nanomodulating a metal film using aluminum substrate recorded with nanovalleys obtained in step a), by evaporating onto said substrate a metal selected from the group consisting of Au, Cu or Ag to generate a metal film then take off, and where evaporation of metal is deposited, it is performed by sputtering in a high vacuum, and the metal evaporated adopts the structure of aluminum nanovalleys, and where to ensure low adhesion of metal deposited on the nanostructured aluminum is used a deposition rate very high, between 59 and 127 nm/min and also a distance of approximately 5 cm between the barrel and the substrate is used;
• c) removing the foil substrate by simply removing the foil deposited aluminum substrate nanovalleys.