Integrated plating and planarization process and apparatus therefor
AssigneeInternational Business Machines Corporation
InventorsLaertis Economikos, Hariklia Deligianni, John M. Cotte, Henry J. Grabarz, Bomy Chen
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Abstract
A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.
Claims20
An apparatus for performing both electroplating of a metal layer and planarization of said layer on a substrate, the planarization being performed by electroetching and chemical-mechanical polishing (CMP), the apparatus comprising:
- a table for supporting a polishing pad and having a plurality of holes forming channels for dispensing an electroplating solution onto the pad;
- the polishing pad, having a top surface and having a plurality of holes therethrough corresponding to the holes in the table;
- a plurality of electroplating anodes disposed in said channels and in contact with the electroplating solution;
- a carrier for holding the substrate substantially parallel to the top surface of the pad and for applying variable mechanical force on the substrate against the pad, the carrier rotating with respect to the table and including a plating cathode;
- and
- a slurry dispenser for dispensing a polishing slurry on the pad during a CMP process,
- wherein the carrier applies a first amount of force during an electroplating process and a second amount of force during an electroetching process.
A method for performing both electroplating of a metal layer and planarization of said layer on a substrate in an integrated plating/planarization tool having a substrate carrier and a table with a polishing pad disposed thereon, the method comprising the steps of:
- loading the substrate on the carrier;
- dispensing electroplating solution onto the pad;
- electroplating the metal on the substrate using the electroplating solution, while applying a first amount of mechanical force on the substrate against the pad to maintain a first spacing between the substrate and the pad;
- dispensing an electroetching solution onto the pad;
- and
- electroetching the metal on the substrate using the electroetching solution, while applying a second amount of mechanical force on the substrate against the pad to maintain a second spacing between the substrate and the pad.
Dependencies are inferred from the claim text.