Y10S 205/915
Electrolytic deposition of semiconductor
Y10S205/915 (Electrolytic deposition of semiconductor) appears on 29 US grants and 0 published applications in this corpus.
Search patents in Y10S- Granted patents
- 29
- Published applications
- 0
- Assignees
- 19
- Inventors
- 57
- Latest grant
- 8 May 2001
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Electrochemical synthesis of crystalline compound or alloy films8 May 2001US 6,228,243 B1
- Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer19 Dec 2000US 6,162,344 ANovellus Systems, Inc.
- Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer29 Aug 2000US 6,110,346 ANovellus Systems, Inc.
- Method of forming reliable copper interconnects with improved hole filling15 Aug 2000US 6,103,086 AAdvanced Micro Devices, Inc.
- Method and apparatus for controlling plating over a face of a substrate18 Jul 2000US 6,090,261 AFormFactor, Inc.
No published applications in this class yet.
Most cited
By later US patents
- Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer203US 6,074,544 ANovellus Systems, Inc. · 2000
- Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer152US 6,162,344 ANovellus Systems, Inc. · 2000
- Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer129US 6,110,346 ANovellus Systems, Inc. · 2000
- Methods of making highly conductive photoelectrochemical electrodes106US 4,592,807 AUnion Oil Company of California · 1986
- Method and apparatus for controlling plating over a face of a substrate85US 6,090,261 AFormFactor, Inc. · 2000