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US 4,888,574 AGranted
Circuit board material and method of making
Assignee501 Ohmega Electronics, Inc.
InventorsJames M. Rice, Bruce P. Mahler
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Assignee501 Ohmega Electronics, Inc.
InventorsJames M. Rice, Bruce P. Mahler
Estimating the term…
An improved multilayered circuit board material and process for making that material is disclosed. The material includes an insulating material support layer, an electrical resistance material layer adhering to the support layer, and a conductive material layer adhering to the resistance material layer and in intimate contact with that layer. The electrical resistance material layer comprises electroplated nickel-phosphorous containing up to about 30% by weight of phosphorous; however, no appreciable amounts of sulfur are present within at least the top about ten atomic layers of the electrical resistance material layer. As a result, the stability of the electrical resistance material layer is significantly increased. In addition, the electroplating bath does not contain chloride salts resulting in decreased pitting in the electrical resistance material layer.
A method of electroplating a circuit board substrate with nickel-phosphorous, the method comprising the steps of:
An electroplating bath used for electroplating a nickel-phosphorous resistance layer on a printed circuit board material stock substrate, the bath consisting essentially of a nickel ion source, phosphoric acid and phosphorous acid, and wherein the bath is substantially sulfate and chloride free.
A substantially sulfate and chloride free electroplating bath used for electroplating a nickel-phosphorous resistance layer on a substrate, the bath consisting essentially of an aqueous solution of 1M nickel ion source, 2M phosphorous acid and 0.5M phosphoric acid.
A process for electroplating an electrical resistance material layer composition on a substrate, the process including the step of electroplating the substrate in a substantially sulfate and chloride free bath consisting essentially of 1 Molar nickel carbonate, 2 Molar phosphorous acid, and 0.5 Molar phosphoric acid, wherein the bath temperature ranges from 70.degree. C. to 75.degree. C., the time of electroplating is 30 seconds and the RsOhms/square ranges from 25 to 50.
A method for forming a printed circuit board material having a nickel-phosphorous electrical resistance material layer in contact with a conductive material and an insulating substrate, the method comprising:
A method of electroplating a nickel-phosphorous composition on a circuit board substrate including the following steps:
Dependencies are inferred from the claim text.