Method for manufacturing printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJong-Jin Lee
Life of this patent
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Abstract
A method of manufacturing a printed circuit board is disclosed. A method of manufacturing a printed circuit board, which includes: forming at least one interlayer connector on a first carrier, stacking at least one insulation layer on the first carrier such that the interlayer connector is exposed, removing the first carrier, and forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector, can be used to increase the density of circuit patterns, as the method can provide electrical connection between circuit patterns and vias without using lands.
Claims5
A method of manufacturing a printed circuit board having a first carrier and a second carrier, the method comprising:
- forming at least one interlayer connector in a shape of a post on the first carrier;
- placing an insulation layer between the first carrier formed with the interlayer connector and the second carrier;
- pressing the first and second carriers together after the placing the insulation layer between the first carrier and the second carrier such that the interlayer connector passes through the insulation layer and is placed in physical contact against the second carrier;
- removing the first and second carriers to expose the insulation layer;
- and
- forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector.
Dependencies are inferred from the claim text.