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AssigneeFurukawa Electric Co., Ltd.
InventorsHajime Watanabe, Sadao Ishihawa, Kiyoteru Yamamoto, Takahiro Imai, Toshihiro Oyoshi
Estimating the term…
Problems to be Solved: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein. Means for Solving the Problems: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plate 4 as a negative electrode and the electrodes 3 as positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate 4. Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.
A method of producing a copper plate with a roughened surface through forming a protrusion in a fine bump shape on a surface of the copper plate to roughen the surface of the copper plate, comprising the steps of:
A device for producing a copper plate with a roughened surface, comprising:
A device for producing a copper plate with a roughened surface, comprising:
A copper plate with a roughened surface having a predetermined hole formed at a predetermined position thereof, a surface of the copper plate including a protrusion with a fine bump shape having a grain size not larger than 10 μm, and a surface roughness Rz between 3 μm and 20 μm.
Dependencies are inferred from the claim text.