Method for manufacturing printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJong-Jin Lee
Life of this patent
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Abstract
A method of manufacturing a printed circuit board is disclosed. A method of manufacturing a printed circuit board, which includes: forming at least one interlayer connector on a first carrier, stacking at least one insulation layer on the first carrier such that the interlayer connector is exposed, removing the first carrier, and forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector, can be used to increase the density of circuit patterns, as the method can provide electrical connection between circuit patterns and vias without using lands.
Claims12
A method of manufacturing a printed circuit board, the method comprising:
- forming at least one interlayer connector on a first carrier;
- stacking at least one insulation layer on the first carrier such that the interlayer connector is exposed;
- removing the first carrier;
- and
- forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector.
A method of manufacturing a printed circuit board, the method comprising:
- providing a core substrate having a first circuit pattern formed thereon;
- forming at least one interlayer connector on the first circuit pattern;
- stacking at least one insulation layer on the core substrate such that the interlayer connector is exposed;
- and
- forming a second circuit pattern on the insulation layer such that the second circuit pattern is electrically coupled with the interlayer connector.
Dependencies are inferred from the claim text.