H10W 80/023
Applying a coating on the bonding area
Official title: {Applying a coating on the bonding area}
H10W80/023 (Applying a coating on the bonding area) appears on 31 US grants and 42 published applications in this corpus.
Search patents in H10W- Granted patents
- 31
- Published applications
- 42
- Assignees
- 22
- Inventors
- 105
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 1 | 4 |
| 2019 | 1 | 1 |
| 2020 | 3 | 4 |
| 2021 | 7 | 6 |
| 2022 | 3 | 5 |
| 2023 | 2 | 7 |
| 2024 | 3 | 4 |
| 2025 | 7 | 5 |
| 2026 | 4 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Selective alteration of interconnect pads for direct bonding29 Sep 2026US 12,751,313 B2Adeia Semiconductor Bonding Technologies Inc.
- Multi-metal contact structure in microelectronic assembly1 Sep 2026US 12,727,514 B2Adeia Semiconductor Bonding Technologies Inc.
- Method of atomic diffusion hybrid bonding and apparatus made from same14 Apr 2026US 12,604,786 B2Intel Corporation
- Next generation bonding layer for 3D heterogeneous integration17 Mar 2026US 12,577,665 B2Tokyo Electron Limited
- Directly bonded metal structures having aluminum features and methods of preparing same23 Dec 2025US 12,506,114 B2Adeia Semiconductor Bonding Technologies Inc.
- Substrate layered body producing method and substrate layered body1 Oct 2026US 2026/0305462 A1Mitsui Chemicals, Inc.
- Semiconductor device and method for manufacturing same17 Sep 2026US 2026/0282505 A1
- Directly bonded metal structures and methods of preparing same5 Mar 2026US 2026/0068781 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor die transfer structure with improved die retention15 Jan 2026US 2026/0018572 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Hybrid bonding apparatus18 Dec 2025US 2025/0385215 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Multi-metal contact structure in microelectronic component173US 11,088,099 B2Invensas Bonding Technologies, Inc. · 2021
- Multi-metal contact structure24US 10,515,913 B2Invensas Bonding Technologies, Inc. · 2019
- Bonded assembly containing oxidation barriers and/or adhesion enhancers and methods of forming the same14US 11,139,272 B2SanDisk Technologies LLC · 2021
- Bonding system6US 10,840,213 B2Tokyo Electron Limited · 2020
- Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogen6US 10,910,782 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives · 2021