H10P 95/04
Planarisation of conductive or resistive materials
Official title: {Planarisation of conductive or resistive materials}
H10P95/04 (Planarisation of conductive or resistive materials) appears on 552 US grants and 596 published applications in this corpus.
Search patents in H10P- Granted patents
- 552
- Published applications
- 596
- Assignees
- 183
- Inventors
- 1,252
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 12 | 0 |
| 2001 | 18 | 2 |
| 2002 | 16 | 26 |
| 2003 | 15 | 15 |
| 2004 | 17 | 40 |
| 2005 | 13 | 28 |
| 2006 | 19 | 20 |
| 2007 | 11 | 30 |
| 2008 | 13 | 19 |
| 2009 | 17 | 16 |
| 2010 | 14 | 12 |
| 2011 | 11 | 8 |
| 2012 | 12 | 12 |
| 2013 | 12 | 10 |
| 2014 | 14 | 18 |
| 2015 | 13 | 60 |
| 2016 | 38 | 40 |
| 2017 | 47 | 46 |
| 2018 | 46 | 40 |
| 2019 | 40 | 36 |
| 2020 | 36 | 31 |
| 2021 | 27 | 17 |
| 2022 | 18 | 11 |
| 2023 | 11 | 15 |
| 2024 | 9 | 14 |
| 2025 | 11 | 15 |
| 2026 | 9 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing method28 Jul 2026US 12,696,743 B2SCREEN Holdings Co., Ltd.
- Soluble metal oxide anion CMP slurry14 Jul 2026US 12,679,998 B2DuPont Electronic Materials Holding, Inc.
- Display apparatus2 Jun 2026US 12,648,283 B2LG Display Co., Ltd.
- Chemical planarization31 Mar 2026US 12,593,637 B2Chempower Corporation
- Method of removing barrier layer24 Feb 2026US 12,564,026 B2ACM Research (Shanghai) Inc.
- Method for manufacturing semiconductor device, and insulating resin material1 Oct 2026US 2026/0305434 A1Resonac Corporation
- Semiconductor Device and Method of Forming Stacked Encapsulated Conductive Pillar Layers as Vertical Interconnect Structure17 Sep 2026US 2026/0282965 A1STATS ChipPAC Pte. Ltd.
- Chemical planarization16 Jul 2026US 2026/0206512 A1Chempower Corporation
- Chemical mechanical planarization method and apparatus in semiconductor manufacturing process18 Jun 2026US 2026/0173786 A1Korea Advanced Nano Fab Center
- Substrate processing system, substrate processing method using the same, and semiconductor device manufacturing method including the same18 Jun 2026US 2026/0173791 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Copper chemical-mechanical-polishing (CMP) dishing287US 6,010,962 ATaiwan Semiconductor Manufacturing Company.Ltd · 2000
- Thinning tungsten layer after through silicon via filling206US 8,153,520 B1Novellus Systems, Inc. · 2012
- Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly197US 6,143,155 ASpeedFam-IPEC Corporation · 2000
- Methods and apparatus for electropolishing metal interconnections on semiconductor devices167US 6,395,152 B1ACM Research, Inc. · 2002
- Method for improving step coverage of a metallization layer on an integrated circuit by use of a high melting point metal as an anti-reflective coating during laser planarization145US 5,032,233 AMicron Technology, Inc. · 1991