Methods and apparatus for electropolishing metal interconnections on semiconductor devices
AssigneeACM Research, Inc.
InventorHui Wang
Life of this patent
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Abstract
An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.
Claims48
An apparatus for electropolishing a metal layer formed on a wafer, comprising:
- a polishing receptacle configured to receive an electrolyte and the wafer,
- wherein said polishing receptacle comprises a first section, a second section, and a third section, and
- wherein said first section is disposed in said second section and said second section is disposed in said third section;
- a wafer chuck configured to hold the wafer and position the wafer within said polishing receptacle;
- a fluid inlet configured to deliver the electrolyte into said polishing receptacle;
- and
- a cathode configured to apply an electropolishing current to the electrolyte to electropolish the wafer.
An apparatus for electropolishing a metal layer formed on a wafer, comprising:
- a polishing receptacle,
- wherein said polishing receptacle comprises a first section, a second section, and a third section, and
- wherein said first section is disposed in said second section and said second section is disposed in said third section;
- a wafer chuck;
- a fluid inlet disposed in said polishing receptacle;
- and
- a cathode disposed in said polishing receptacle.
An apparatus for electropolishing a metal layer formed on a wafer, comprising:
- a polishing receptacle having:
- a first section,
- a second section, wherein said first section is disposed in said second section, and
- a third section, wherein said second section is disposed in said third section;
- a fluid inlet disposed in said polishing receptacle;
- and
- a cathode disposed in said polishing receptacle.
Dependencies are inferred from the claim text.