Substrate processing system, substrate processing method using the same, and semiconductor device manufacturing method including the same

A substrate processing method comprising:

• measuring a surface level of a substrate;
• and
• performing a polishing process on the substrate based on the measured surface level of the substrate,
• wherein the performing of the polishing process comprises:
• performing a first polishing process in a first polishing apparatus, and
• performing a second polishing process in a second polishing apparatus, and
• wherein a temperature of the first polishing process is lower than a temperature of the second polishing process.

A semiconductor device manufacturing method comprising:

• forming an active pattern, a source/drain pattern, a channel pattern, and a gate electrode on a first surface of a substrate;
• forming a metal layer comprising lines on the gate electrode;
• performing a polishing process on a second surface of the substrate that is opposite to the first surface;
• and
• forming a power delivery network layer on the second surface,
• wherein the polishing process comprises:
• a first polishing process performed at a first temperature, and
• a second polishing process performed at a second temperature that is different from the first temperature.