Substrate processing method
AssigneeSCREEN Holdings Co., Ltd.
InventorsKana Tahara, Masaki Inaba
Life of this patent
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Abstract
An etching liquid is supplied to a principal surface of a substrate that has the principal surface on which a processing object layer having a plurality of crystal grains is exposed (first etching step). A polymer-containing liquid containing a polymer is supplied to the principal surface of the substrate after the first etching step, and a polymer layer at least portion of which is embedded in a crystal grain boundary which is a boundary of the crystal grains is formed (polymer layer forming step). The processing object layer is etched by supplying an etching liquid to the principal surface of the substrate after the polymer layer forming step (second etching step).
Claims10
A substrate processing method, comprising:
- a first etching step of supplying an etching liquid to a principal surface of a substrate that has the principal surface on which a processing object layer having a plurality of crystal grains is exposed;
- a polymer layer forming step of supplying a polymer-containing liquid containing a polymer to the principal surface of the substrate after the first etching step, and forming a polymer layer at least portion of which is embedded in a crystal grain boundary which is a boundary of the crystal grains;
- and
- a second etching step of supplying an etching liquid to the principal surface of the substrate after the polymer layer forming step, and etching the processing object layer.
Dependencies are inferred from the claim text.