H10P 95/02
Planarisation of semiconductor materials
Official title: {Planarisation of semiconductor materials}
H10P95/02 (Planarisation of semiconductor materials) appears on 2 US grants and 12 published applications in this corpus.
Search patents in H10P- Granted patents
- 2
- Published applications
- 12
- Assignees
- 10
- Inventors
- 28
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 2 |
| 2025 | 0 | 2 |
| 2026 | 1 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Substrate processing method and substrate processing apparatus17 Sep 2026US 2026/0273651 A1Tokyo Electron Limited
- Method for surface treatment of a substrate and method for bonding such a substrate to a further substrate, and a device for carrying out such methods17 Sep 2026US 2026/0282853 A1EV Group E. Thallner GmbH
- Processing method, processing device, and substrate manufacturing method28 May 2026US 2026/0145292 A1Disco Corporation
- Semiconductor device and methods for manufacturing and inspecting the same28 May 2026US 2026/0150593 A1Highlight Tech Corp.
- System to Reduce Induced Subsurface Damage in Separation of Semiconductor Workpieces12 Mar 2026US 2026/0070263 A1Wolfspeed, Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.