Method for surface treatment of a substrate and method for bonding such a substrate to a further substrate, and a device for carrying out such methods
AssigneeEV Group E. Thallner GmbH
InventorPeter KEREPESI
Life of this patent
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Abstract
A method for surface treatment of a substrate (B), in particular as a preparatory step for a method for bonding the substrate to a further substrate, including: —providing the substrate (B) having a bonding surface provided for the bonding, —treating (100) the substrate (B) at least in a portion of the bonding surface to form an amorphous layer (C) having a first thickness (D1), a primary particle radiation preferably being used for forming the amorphous layer (C), and —reducing (200) the layer thickness of the amorphous layer (C), preferably to a second thickness (D2).
Claims13
1-15. (canceled)
A method for surface treatment of a substrate (B), comprising:
- providing the substrate (B) with a bonding surface intended for bonding,
- treatment (100) of the substrate (B) at least in a subsection of the bonding surface to form an amorphous layer (C) with a first thickness (D1), and
- layer thickness reduction (200) of the amorphous layer (C), wherein, for forming the amorphous layer (C), the primary particle radiation with particles comprising a first kinetic energy is realized and, for layer thickness reduction (200) of the amorphous layer (C) a secondary particle radiation with particles comprising a second kinetic energy is realized, wherein the second kinetic energy is smaller than the first kinetic energy.
Dependencies are inferred from the claim text.