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US 2026/0145292 A1Published application
Processing method, processing device, and substrate manufacturing method
AssigneeDisco Corporation
InventorsNobuki Kakiuchi, Mami Saeki, Maho Hirakawa
Life of this patent
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Abstract
A processing method includes: acquiring data on an impurity concentration of a workpiece; and planarizing one surface of the workpiece held on a holding table by grinding or polishing the one surface with a planarization processor, and in the planarizing, the one surface of the workpiece is planarized based on the data acquired in the acquiring.
Claims20
A processing method comprising:
- acquiring data on an impurity concentration of a workpiece;
- and
- planarizing one surface of the workpiece held on a holding table by grinding or polishing the one surface with a planarization processor, wherein
- in the planarizing, the one surface of the workpiece is planarized based on the data acquired in the acquiring.
1 more element
A processing device for processing one surface of a workpiece held on a holding table, the processing device comprising:
- a spindle extending in a predetermined direction and rotatably provided;
- a mount fixed to a tip end of the spindle;
- and
- a planarization processor fixed to the mount and configured to grind or polish the one surface of the workpiece to planarize the one surface, wherein
- the processing device planarizes the one surface of the workpiece by the planarization processor based on data on an impurity concentration of the workpiece.
2 more elements
Dependencies are inferred from the claim text.