H10P 72/165
Characterised by a material, a roughness, a coating or the like
Official title: {characterised by a material, a roughness, a coating or the like}
H10P72/165 (Characterised by a material, a roughness, a coating or the like) appears on 44 US grants and 63 published applications in this corpus.
Search patents in H10P- Granted patents
- 44
- Published applications
- 63
- Assignees
- 55
- Inventors
- 182
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 2 |
| 2002 | 4 | 2 |
| 2003 | 0 | 0 |
| 2004 | 1 | 3 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 0 | 3 |
| 2008 | 0 | 1 |
| 2009 | 2 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 4 |
| 2014 | 1 | 2 |
| 2015 | 1 | 1 |
| 2016 | 1 | 2 |
| 2017 | 5 | 4 |
| 2018 | 0 | 3 |
| 2019 | 3 | 2 |
| 2020 | 4 | 1 |
| 2021 | 1 | 5 |
| 2022 | 3 | 4 |
| 2023 | 2 | 4 |
| 2024 | 2 | 4 |
| 2025 | 2 | 5 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and methods of making and using an enhanced carrier to reduce electrostatic discharge24 Mar 2026US 12,588,463 B2STATS ChipPAC Pte. Ltd.
- Rigid carrier assemblies with tacky media molded thereon12 Aug 2025US 12,387,957 B2Daewon Semiconductor Packaging Industrial Company
- Carrier plate and transferring device5 Aug 2025US 12,381,100 B2Boe Technology Group Co., Ltd.
- Patterned carrier assemblies having an integrated adhesive film26 Nov 2024US 12,154,805 B2Daewon Semiconductor Packaging Industrial Company
- Stacking arrays and separator bodies during processing of component carriers on array level26 Mar 2024US 11,943,874 B2AT&S (Chongqing) Company Limited
- Film tray semiconductor chip carrier17 Sep 2026US 2026/0282817 A1Arm Limited
- Semiconductor carrier6 Aug 2026US 2026/0231725 A1Ennostar Corporation
- Masking device for packaging tray12 Mar 2026US 2026/0076142 A1SSP Co., Ltd.
- Tray12 Mar 2026US 2026/0076143 A1Suzhou Remus Precision Technology Co., Ltd.
- Methods for reducing defects during die placement15 Jan 2026US 2026/0018444 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Component carrier tray for high-temperature applications33US 6,227,372 B1Peak International, Inc. · 2001
- Magnetic boats24US 5,669,599 AHarris Corporation · 1997
- Tray for integrated circuits21US 5,848,703 AR. H. Murphy Co., Inc. · 1998
- Product holder18US 6,261,370 B1Bridgestone Corporation · 2001
- Tacky film frame for electronic device16US 5,833,073 AFluoroware, Inc. · 1998