Carrier plate and transferring device
AssigneeBoe Technology Group Co., Ltd.
InventorHaixu Li
Life of this patent
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Abstract
The embodiments of the present application provide a carrier plate and a transferring device. The carrier plate particularly includes a transporting base plate, a dissociation regulating feature and a dissociable-adhesive layer that are sequentially arranged, the dissociation regulating feature is configured to regulate a dissociation accuracy of the dissociable-adhesive layer, and the dissociable-adhesive layer is configured to be connected to a plurality of light-emitting-diode chips. The carrier plate can increase the yield and the dissociation accuracy of the light-emitting-diode chips, which can increase the yield in the process of the mass transfer and the efficiency of the mass transfer of the light-emitting-diode chips.
Claims10
A carrier plate, wherein the carrier plate comprises:
- a transporting base plate, a dissociation regulating feature and a dissociable-adhesive layer that are sequentially arranged, wherein the dissociation regulating feature is configured to regulate a dissociation accuracy of the dissociable-adhesive layer, and the dissociable-adhesive layer is configured to be connected to a plurality of light-emitting-diode chips;
- wherein the dissociation regulating feature comprises:
- an arc-shaped protrusion provided on one side of the dissociable-adhesive layer that is closer to the transporting base plate.
A carrier plate, wherein the carrier plate comprises:
- a transporting base plate, a dissociation regulating feature and a dissociable-adhesive layer that are sequentially arranged, wherein the dissociation regulating feature is configured to regulate a dissociation accuracy of the dissociable-adhesive layer, and the dissociable-adhesive layer is configured to be connected to a plurality of light-emitting-diode chips;
- wherein the dissociable-adhesive layer comprises:
- a laser dissociation layer and a viscous-adhesive-material layer, the laser dissociation layer is located on one side of the transporting base plate that is closer to the light-emitting-diode chips, and the viscous-adhesive-material layer is located between the laser dissociation layer and the light-emitting-diode chips;
- and
- the viscous-adhesive-material layer is provided with a first micro-feature on a side that is closer to the laser dissociation layer, the laser dissociation layer is provided with a second micro-feature on a side that is closer to the viscous-adhesive-material layer, a shape of the second micro-feature and a shape of the first micro-feature are complementary, and the second micro-feature and the first micro-feature are embedded into each other.
Dependencies are inferred from the claim text.