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US 2026/0076142 A1Published application
Masking device for packaging tray
AssigneeSSP Co., Ltd.
InventorYoung-sik KI
Life of this patent
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Abstract
Proposed is a masking device for a packaging tray, which enables laser processing of a chip without thermal damage to a packaging tray by installing the masking device on the packaging tray while the chip placed on the packaging tray is vertically raised by a heating block. The masking device may include a mask part installed in a grid shape above a packaging tray in which a mounting part on which a chip is mounted is provided to form a number of rows and columns to protect the packaging tray from a heat source.
Claims6
A masking device for a packaging tray, the device comprising:
- a mask part installed in a grid shape above a packaging tray in which a mounting part on which a chip is mounted is provided to form a number of rows and columns to protect the packaging tray from a heat source,
- wherein the mask part comprises:
- a first mask installed transversely on the packaging tray;
- and
- a second mask installed longitudinally on the packaging tray so as to intersect with the first mask,
- wherein the second mask is installed to penetrate or overlap the first mask.
3 more elements
A masking device for a packaging tray, the device comprising:
- a mask part installed in a grid shape above a packaging tray in which a mounting part on which a chip is mounted is provided to form a number of rows and columns to protect the packaging tray from a heat source,
- wherein the mask part comprises a third mask and a fourth mask that are stacked vertically,
- wherein the third mask and the fourth mask are each provided with a plurality of rows and columns of through holes shaped and sized to allow a chip mounted on a vertical member of a heating block to pass through are arranged in a grid shape.
Dependencies are inferred from the claim text.