Stacking arrays and separator bodies during processing of component carriers on array level
AssigneeAT&S (Chongqing) Company Limited
InventorsAmin Nickkolgh, Yu-Hui Wu, Ismadi Bin Ismail
Life of this patent
Estimating the term…
Abstract
A method of processing component carriers is disclosed. The method includes providing a plurality of arrays each comprising a plurality of component carriers, providing a plurality of separator bodies, forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body, and carrying out at least one process, in particular at least one back-end process, using the stack. A separator sheet for spacing arrays and a method of using separator sheets for spacing arrays during processing the arrays are also provided.
Claims18
A method of processing component carriers, comprising:
- providing a plurality of arrays each comprising a plurality of component carriers;
- providing a plurality of separator bodies;
- forming an alternating stack of the arrays and the separator bodies so that each adjacent pair of stacked arrays is spaced by a respective separator body;
- and
- carrying out at least one process using the stack,
- wherein the separator bodies are separator sheets and the separator sheets have a thickness in a range between 30 μm and 100 μm.
Dependencies are inferred from the claim text.