Rigid carrier assemblies with tacky media molded thereon
AssigneeDaewon Semiconductor Packaging Industrial Company
InventorsSunna Chung, Matthew Stanton Whitlock, Athens Okoren, Brent Dae Hermsmeier
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Abstract
Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-molded component that is secured to the deck area of the primary injection-molded component. For example, the secondary injection-molded component may be overmolded on the deck area of the primary injection-molded component. The secondary injection-molded component may have a tacky upper surface that facilitates securement of the semiconductor components to the primary injection-molded component.
Claims15
A method for manufacturing a carrier assembly for semiconductor components, the method comprising:
- ejecting a first liquified media into a mold to create a tray having a substantially planar deck with (i) a cavity defined therein and (ii) a structural feature arranged along a periphery of the substantially planar deck, wherein to remove the tray from the mold, pressure is applied to the structural feature rather than the substantially planar deck;
- removing the mold;
- ejecting a second liquified media onto the substantially planar deck of the tray, such that the second liquified media flows into the cavity and forms, along at least a portion of the substantially planar deck, a tacky surface;
- and
- enabling semiconductor components to be detachably secured to the tacky surface along the substantially planar deck of the tray.
A method comprising:
- obtaining a tray that has a substantially planar deck on which a semiconductor component is to be secured and one or more features around a periphery of the substantially planar deck, wherein the substantially planar deck has one or more cavities defined therein;
- and
- ejecting liquified thermoplastic elastomer onto the substantially planar deck of the tray, wherein the one or more features around the periphery inhibit overflow of the liquified thermoplastic elastomer from the substantially planar deck while the liquified thermoplastic elastomer flows into the one or more cavities and forms, along the substantially planar deck of the tray, a flexible injection-molded component having one or more anchoring features, each of which corresponds to a different one of the one or more cavities, and a tacky upper surface;
- wherein tackiness of the flexible injection-molded component is sufficient to allow the semiconductor component to be detachably secured to the tacky upper surface through stiction.
Dependencies are inferred from the claim text.