H10P 58/22
Characterised by the singulation processes being performed on multiple sides of the
Official title: {characterised by the singulation processes being performed on multiple sides of the wafer or substrate}
H10P58/22 (Characterised by the singulation processes being performed on multiple sides of the) appears on 0 US grants and 8 published applications in this corpus.
Search patents in H10P- Granted patents
- 0
- Published applications
- 8
- Assignees
- 5
- Inventors
- 24
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 6 |
By publication year. 2026 runs to 8 Oct.
Recent patents
No granted patents in this class yet.
- Dual side stealth dicing for forming memory chips1 Oct 2026US 2026/0305216 A1Micron Technology, Inc.
- Method for cleaning semiconductor chip, and method for manufacturing semiconductor device1 Oct 2026US 2026/0305220 A1
- Wafer processing method24 Sep 2026US 2026/0293566 A1Disco Corporation
- Backside markings and marking grooves for wafer-level chip scale packaging dice6 Aug 2026US 2026/0231710 A1Cirrus Logic International Semiconductor Ltd.
- Method of manufacturing semiconductor device and semiconductor device7 May 2026US 2026/0130152 A1Kioxia Corporation
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