Method of manufacturing semiconductor device and semiconductor device

Abstract

Embodiments provide a method of manufacturing a semiconductor device, including forming two grooves that extend from a first surface of a semiconductor wafer along a dicing region of the semiconductor wafer and are arranged side by side, the semiconductor wafer including the first surface and a second surface opposite to the first surface. The manufacturing method includes irradiating between the two grooves from the second surface of the semiconductor wafer with a first laser beam when viewed from above to form a modified portion in the semiconductor wafer along the dicing region. The manufacturing method includes cleaving the semiconductor wafer to segment the semiconductor wafer into a plurality of semiconductor chips.

Dependencies are inferred from the claim text.