H10P 14/69471
Characterised by the metal
Official title: {characterised by the metal}
H10P14/69471 (Characterised by the metal) appears on 0 US grants and 5 published applications in this corpus.
Search patents in H10P- Granted patents
- 0
- Published applications
- 5
- Assignees
- 4
- Inventors
- 16
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2026 | 0 | 5 |
By publication year. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 14/69472The material containing aluminium0
- H10P 14/69473The material containing hafnium0
- H10P 14/69474The material containing tantalum0
- H10P 14/69475The material containing titanium0
- H10P 14/69476The material containing zirconium0
- H10P 14/69477The material containing at least one rare earth metal element0
- H10P 14/69478The material containing two or more metal elements0
Recent patents
No granted patents in this class yet.
- Method of Providing a Multi-layer Adhesion Layer on a Workpiece17 Sep 2026US 2026/0282772 A1
- Film forming method and film forming apparatus3 Sep 2026US 2026/0258548 A1Tokyo Electron Limited
- Localized film stress modulation by implant20 Aug 2026US 2026/0247885 A1APPLIED Materials.Inc.
- Deposition of ain on a silicon substrate and gan semiconductor transition layer structure6 Aug 2026US 2026/0231701 A1Epinovatech AB
- Methods for depositing a layer including group iii and group v elements on a silicon substrate30 Jul 2026US 2026/0223608 A1Aixtron SE
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.