H10P 14/69472
The material containing aluminium
Official title: {the material containing aluminium}
H10P14/69472 (The material containing aluminium) appears on 0 US grants and 3 published applications in this corpus.
Search patents in H10P- Granted patents
- 0
- Published applications
- 3
- Assignees
- 3
- Inventors
- 9
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2026 | 0 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
No granted patents in this class yet.
- Localized film stress modulation by implant20 Aug 2026US 2026/0247885 A1APPLIED Materials.Inc.
- Deposition of ain on a silicon substrate and gan semiconductor transition layer structure6 Aug 2026US 2026/0231701 A1Epinovatech AB
- Methods for depositing a layer including group iii and group v elements on a silicon substrate30 Jul 2026US 2026/0223608 A1Aixtron SE
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.