H10N 97/00
Electric solid-state thin-film or thick-film devices, not otherwise provided for
H10N97/00 (Electric solid-state thin-film or thick-film devices, not otherwise provided for) appears on 88 US grants and 78 published applications in this corpus.
Search patents in H10N- Granted patents
- 88
- Published applications
- 78
- Assignees
- 57
- Inventors
- 275
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 4 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 1 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 2 |
| 2014 | 0 | 1 |
| 2015 | 2 | 2 |
| 2016 | 2 | 0 |
| 2017 | 1 | 1 |
| 2018 | 3 | 6 |
| 2019 | 4 | 8 |
| 2020 | 4 | 2 |
| 2021 | 5 | 6 |
| 2022 | 0 | 14 |
| 2023 | 1 | 14 |
| 2024 | 9 | 2 |
| 2025 | 12 | 13 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Silicon capacitor with thin film deposition on 3D structure and its manufacturing method2 Jun 2026US 12,646,655 B2Elspes Inc.
- Method for forming semiconductor structure, laminate structure, and method for forming laminate structure13 Jan 2026US 12,527,010 B2Changxin Memory Technologies, Inc.
- Substrate integrated with passive device and method for manufacturing the same13 Jan 2026US 12,527,091 B2Boe Technology Group Co., Ltd.
- Method for manufacturing capacitor array, capacitor array, and semiconductor device30 Dec 2025US 12,513,917 B2Changxin Memory Technologies, Inc.
- Capacitor component and integrated circuit chip package including same23 Jul 2026US 2026/0213079 A1Point Engineering Co., Ltd.
- Diode made of ice28 May 2026US 2026/0150312 A1
- Method for forming capacitor electrode7 May 2026US 2026/0128218 A1Jusung Engineering Co., Ltd.
- Metal nanosheet, method for manufacturing same, and all-metal three-terminal electrical switching device having novel structure including same23 Apr 2026US 2026/0114188 A1Industry-Academic Cooperation Foundation, Yonsei University
- Integration of optically active and diamond-based color centers with semiconductor substrates for quantum devices2 Apr 2026US 2026/0096358 A1IonQ, Inc.
Most cited
By later US patents
- Thermal ink jet printhead and process therefor156US 4,601,777 AXerox Corporation · 1986
- Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture70US 4,695,853 AHewlett-Packard Company · 1987
- Thin film device for an ink jet printhead and process for the manufacturing same58US 4,809,428 AHewlett-Packard Company · 1989
- Thick-film thermal printing head44US 4,203,025 AHitachi, Ltd. · 1980
- Thermal head38US 4,296,309 ACanon Kabushiki Kaisha · 1981