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AssigneeHewlett-Packard Company
InventorsDavid E. Hackleman, James G. Bearss, Eldurkar V. Bhaskar
Estimating the term…
The specification describes thermal ink jet (TIJ) processes and device structures produced thereby wherein either heater resistors or heater resistor-diode combinations are constructed vertically upward from a common supporting substrate. A lower or first metal level conductor pattern provides one part of an X-Y matrix multiplex connection to the resistor/diode components, and a second, upper metal level conductor pattern forms the second part of the X-Y matrix multiplex connection. In this manner, the multiplex drive circuitry for the TIJ printhead resistors/diodes may be fabricated (integrated) directly on the thin film resistor (TFR) printhead substrate. Additionally, the second level metal conductors which overlie the resistive heater and diode elements also serve as a barrier shield to ink corrosion and cavitation wear.
A thin film resistor device suitable for use in a thermal ink jet printhead comprising:
In a thermal ink jet heater device wherein an insulating pattern is formed on a substrate, the improvement comprising a heater resistor disposed in an opening in said insulating pattern, and conductive leads disposed on the top and bottom surfaces of said heater resistor to provide current vertically through said heater resistor during an ink jet printing operation.
A process for manufacturing a thermal ink jet thin film resistor device which includes the steps of :
An integrated X-Y matrix diode multiplex circuit and resistive heater printhead structure which includes:
A process for fabricating a vertical resistor printhead structure which includes;
Dependencies are inferred from the claim text.