Thin film device for an ink jet printhead and process for the manufacturing same
AssigneeHewlett-Packard Company
InventorsJames S. Aden, Jeffrey A. Kahn
Life of this patent
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AssigneeHewlett-Packard Company
InventorsJames S. Aden, Jeffrey A. Kahn
Estimating the term…
A process for manufacturing a thin film resistor substrate useful, for example, in fabricating an ink jet printhead, wherein discontinuous strips of conductive material are initially patterned on the surface of a resistive layer. These strips are formed using a first series of masking and etching steps of define an "X" dimension of a resistive heater element. Then, the conductive strips and resistive material therebetween are completely masked in preparation for a subsequent, second etching step used to remove the exposed portions of the resistive layer and thereby define a "Y" dimension of the resistive heater element. These steps leave smooth contours, good step coverage and high quality bevelled edges of the thus defined conductive and resistive layers. These layers are now ready for subsequent passivation layer, barrier layer and orifice plate deposition processes to complete a thin film printhead for use in an ink jet printer.
A process for fabricating a thin film resistor device which comprises the steps of:
An ink jet printhead for an ink jet printer and having a thin film resistor substructure for receiving in succession a barrier layer and orifice plate for ejecting ink onto a print medium, characterized in that said thin film resistor substructure is fabricated by the process of:
A process for defining the X and Y lateral dimensions of a planar transducer element formed in a layer of selected transducer material which comprises the steps of:
Dependencies are inferred from the claim text.