Substrate integrated with passive device and method for manufacturing the same

A method for manufacturing a substrate integrated with a passive device, comprising:

• providing a dielectric layer, and forming a first connection via penetrating through the dielectric layer;
• integrating the passive device on the dielectric layer;
• wherein the passive device at least comprises an inductor comprising a plurality of first sub-structures and a plurality of second sub-structures respectively on two opposite sides of the dielectric layer, and two adjacent first sub-structures of the plurality of first sub-structures are short-circuited by a corresponding one of the plurality of second sub-structures through the first connection via penetrating through the dielectric layer, so as to form an induction coil of the inductor, wherein the induction coil comprises a first signal terminal and a second signal terminal,
• the method further comprises:
• forming a first interlayer dielectric layer on a side of the plurality of second sub-structures away from the dielectric layer, and forming a first pad and a second pad on a side of the first interlayer dielectric layer away from the dielectric layer,
• wherein the first pad is electrically connected to the first signal terminal of the induction coil through a second connection via penetrating through the first interlayer dielectric layer;
• and the second pad is electrically connected to the second signal terminal of the induction coil through a third connection via penetrating through the first interlayer dielectric layer.